JPH0512437B2 - - Google Patents

Info

Publication number
JPH0512437B2
JPH0512437B2 JP62331539A JP33153987A JPH0512437B2 JP H0512437 B2 JPH0512437 B2 JP H0512437B2 JP 62331539 A JP62331539 A JP 62331539A JP 33153987 A JP33153987 A JP 33153987A JP H0512437 B2 JPH0512437 B2 JP H0512437B2
Authority
JP
Japan
Prior art keywords
coated
electrodeposition
liquid
electrodeposition coating
electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP62331539A
Other languages
English (en)
Japanese (ja)
Other versions
JPH01172595A (ja
Inventor
Hiroshige Hibi
Toshihiko Takano
Yasuo Hirota
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ibiden Co Ltd
Original Assignee
Ibiden Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibiden Co Ltd filed Critical Ibiden Co Ltd
Priority to JP33153987A priority Critical patent/JPH01172595A/ja
Publication of JPH01172595A publication Critical patent/JPH01172595A/ja
Publication of JPH0512437B2 publication Critical patent/JPH0512437B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0079—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the method of application or removal of the mask

Landscapes

  • Manufacturing Of Printed Wiring (AREA)
  • Electroplating Methods And Accessories (AREA)
JP33153987A 1987-12-25 1987-12-25 電着塗装装置 Granted JPH01172595A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP33153987A JPH01172595A (ja) 1987-12-25 1987-12-25 電着塗装装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP33153987A JPH01172595A (ja) 1987-12-25 1987-12-25 電着塗装装置

Publications (2)

Publication Number Publication Date
JPH01172595A JPH01172595A (ja) 1989-07-07
JPH0512437B2 true JPH0512437B2 (en]) 1993-02-18

Family

ID=18244788

Family Applications (1)

Application Number Title Priority Date Filing Date
JP33153987A Granted JPH01172595A (ja) 1987-12-25 1987-12-25 電着塗装装置

Country Status (1)

Country Link
JP (1) JPH01172595A (en])

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0562573U (ja) * 1992-01-30 1993-08-20 トリニティ工業株式会社 隔膜電極装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4829372A (en]) * 1971-08-18 1973-04-18

Also Published As

Publication number Publication date
JPH01172595A (ja) 1989-07-07

Similar Documents

Publication Publication Date Title
EP0568733B1 (en) Low profile copper foil and process for making bondable metal foils
JP6448494B2 (ja) サクションめっき装置
US5015340A (en) Method of continuous coating of electrically conductive substrates
JPH06228791A (ja) 電気めっき装置
JP3150370U (ja) 電解めっき装置
US2933438A (en) Electro processing and apparatus therefor
US6342146B1 (en) Lead-free alloy plating method
JP4579306B2 (ja) 円形めっき槽
JPH0512437B2 (en])
TWI615510B (zh) 吸入鍍覆裝置
JPH0242915B2 (en])
JP2535278B2 (ja) プリント配線基板のメッキ方法及びその装置
KR20230015910A (ko) 도금조, 도금 장치 및 전해 도금 방법
KR200358909Y1 (ko) 양면 균일 도금층을 갖게 하는 전기도금장치
JPS6120034Y2 (en])
JPS6277494A (ja) プリント基板のメツキ装置
JPH0241873Y2 (en])
KR19980014624A (ko) 분사 전기도금 방법
JPH0348211Y2 (en])
CN213652697U (zh) 一种水平全浸没式电镀设备
TWI404833B (zh) 電鍍系統及電鍍方法
US4663016A (en) Apparatus for electrodeposition coating
JPH01168890A (ja) 電気めつき装置
KR100340488B1 (ko) 고속도금용연속전기도금장치
JPH01139799A (ja) バレルメッキ装置